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ElectroFlo x64

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license: Demo
downloads: 315
size: 114 MB
updated: 2012-07-29

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x64 native software

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TES International
ElectroFlo x64 is an electronics cooling package designed for high power density applications. It is a fully featured and efficient thermal analysis software that combines the power of coupled thermal/electrical analysis with the ease-of-use of an object oriented Graphical User Interface to provide solutions to challenging problems facing today's electronics analysts and designers. The software can be used for the component level, pcb analysis, and all the way up to the system level.

ElectroFlo x64 Features:

Graphical User Interface
On-Line Help (Topical and Context Sensitive)
Transient/Steady-State Solutions
Multi System Modeling
Conduction, Convection, Radiation, Conjugate Heat Transfer
Geometry Import (STEP, IDF, STL...)
Full Computational Fluid Dynamics (CFD) (Solve for Flow and Pressure In Addition to Temperature) and Non-Computational Fluid Dynamics (CFD)
(No Flow Calculations) Solution Methods
Automatic Calculation and Application of Radiative Viewfactors
Patented 1 Button Click Application of Radiation For Entire Model
Full User Control Over Complexity of Radiosity Network Generated
Fully Automatic Meshing
Laminar/Turbulent Flows
User Extensible Material Properties Library
User Extensible Component Library
User Extensible Convection Correlation Library for non-Computational Fluid Dynamics (CFD) solutions
Object Based Modeling (Component, Boards, Walls and Enclosures)
Open and Porous Boundaries
Advanced Post Processing Features:
Combined Vector-Temperature Fringe Plots
Bar Chart Generation Showing Selected Component Temperatures
Extensive Automatic Report Generation
Average Temperature Calculation Over User Specified Region
X-Y Plotting
Nonlinear Boundary Conditions
Spatial, Time and / or Temperature Dependent
Tabular or Functional Specification
Periodic Boundary Conditions
Coupled Thermal/Electrical Analysis
Solve for Temperature, Flow and Voltage Fields using Electrical Current and
Voltage Boundary Conditions
Heat Exchanger/Fluid Network Boundary Condition
Point-to-Point Thermal/Electrical Links
Provide Additional Heat/Current Path by Specifying Resistance.
Ideal For Modeling Leads and Cables.
Extensive List of Tools

User Rating: 1.7 (9 votes)

x64 native software
OS: Windows Vista x64, Windows 7 x64, Windows 8 x64

ElectroFlo x64 screenshot

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